Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair

Features:

• RL-404 138°C lead-free low-temperature solder paste, a low-temperature lead-free solder paste customized for high-end motherboard repair

• Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store

• Low Melting Point /High Density/High Resistance Strong Activity/Strong Welding Force

• Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution

• Meet the maintenance needs of motherboards for Huawei and Apple high-end machines

Package includes:

• 1 x Tin Paste

 

Noted:
Due to FedEx DHL can not send out the parcel that comes with Liquid, so we just can send out it by Post - Standard Mail or Registered Mail. If your order has other products, we will take out this to send by Post - Standard Mail or Registered Mail, and other products will send out by the courier which you choose. Thanks for understanding.