Features: 

1.6 in 1 design, which can implant a plurality of chips.

2.These stencils were made of high quality stainless steel plate, the thickness of steel mesh is appropriate. 

3.It adopted the special plump design which can avoid dissipation.

4.It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering.

5. It is specially designed for BGA153/ 162/ 169/ 186/ 221/ 254/ EMMC.  

Specifications: 

Material:  High Quality Stainless Steel 

Weight: Approx. 6g 

Compatible with: BGA221, BGA153, BGA169, BGA254, BGA162, BGA186  

Package Included:

1 x BGA stencils

Note:

1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding.

2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.