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TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair

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TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair Voltage:110V-220V Power:100W Laser power:55W heating temperature:100-450℃ microscope:4KCCD pixel:4800万


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  • $1,416.40
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Categories: BRAND ACCESSORIES/ TBK

TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair

 

Voltage:110V-220V
 
Power:100W
 
Laser power:55W
 
heating temperature:100-450℃
 
microscope:4KCCD
 
pixel:4800万(4800million)
 
Machine size:290*290*340mm
 
Wooden box size:425*355*325mm
 
net weight:6.2KG
 
Gross weight:8.4KG
 

 

 

1)Thermal imaging and high-definition diagnostic function-Automatic detection of positive and negative pole thermal imaging mainboard connection.when the power supply temperature is too high, you can notice it.

 

2)Precise constant temperature control on laser heating;

 

3)Low power consumption (55W ) but fast heating;

 

4)No thermal radiation, no influence on working ambient temperature;

 

5)Space heating solder,;

 

6)Easy to operate for chip maintenance!

 

7)Aviation grade all aluminium fuselage (net weight is only 6.2 Kg)

 

TBK R2201 Intelligent Infrared Laser Desoldering Machine with Microscope For Phone Motherboard Short-Circuit Disassemble Repair

 

Voltage:110V-220V
 
Power:100W
 
Laser power:55W
 
heating temperature:100-450℃
 
microscope:4KCCD
 
pixel:4800万(4800million)
 
Machine size:290*290*340mm
 
Wooden box size:425*355*325mm
 
net weight:6.2KG
 
Gross weight:8.4KG
 

 

 

1)Thermal imaging and high-definition diagnostic function-Automatic detection of positive and negative pole thermal imaging mainboard connection.when the power supply temperature is too high, you can notice it.

 

2)Precise constant temperature control on laser heating;

 

3)Low power consumption (55W ) but fast heating;

 

4)No thermal radiation, no influence on working ambient temperature;

 

5)Space heating solder,;

 

6)Easy to operate for chip maintenance!

 

7)Aviation grade all aluminium fuselage (net weight is only 6.2 Kg)

 

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